The Background and Principle of Semiconductor Cooling
Semiconductor Cooling mainly uses the Seebeck effect (when two different conductors are connected, if the two connection points maintain a different temperature, a thermoelectromotive force is generated in the conductor) and the Peltier effect (When the current flows through the junction formed by two different conductors, the phenomenon of heat release and absorption will occur at the junction, and the amount of heat release or absorption is determined by the amount of the current). The high and low temperature difference between the front and back of the component is generated to achieve the cooling or heating effect.
Semiconductor chip also be called thermoelectric chip, are a kind of heat pump. Its advantage is that there are no sliding parts, and it is used in some occasions where space is limited, reliability is high, and there is no refrigerant pollution. Utilizing the Peltier effect of semiconductor materials, when direct current passes through a galvanic couple composed of two different semiconductor materials in series, the two ends of the galvanic couple can absorb heat and release heat respectively, which can achieve the purpose of cooling. It is a refrigeration technology that produces negative thermal resistance. It is characterized by no moving parts and high reliability.
The Advantages of Semiconductor Cooling
1. It does not need any refrigerant, and it can work continuously, there is no pollution source, no rotating parts, no rotation effect, no sliding part, and there is no vibration, noise, long life, and easy installation.
2. Semiconductor cooling chip is a current-transducer type chip. Through the control of input current, high-precision temperature control can be realized. Coupled with temperature detection and control means, it is easy to realize remote control, program control, and computer control, which is convenient to form an automatic control system.
3. The thermal inertia of the semiconductor cooling chip is very small, and the cooling time is very fast. When the hot end has good heat dissipation and the cold end is unloaded, the cooling fin can reach the maximum temperature difference in less than one minute.
4. The power of a single refrigeration element pair of a semiconductor refrigeration chip is very small, but it is combined into a stack, and the same type of stack is used in a series or parallel method to form a refrigeration system, the power can be made large, so the cooling power can be achieved The range of a few watts to tens of thousands of watts.
5. The temperature difference range of the semiconductor refrigeration sheet can be realized from a positive temperature of 90°C to a negative temperature of 130°C.
The Appliance of the Semiconductor Cooling
1. Military: infrared detection and navigation systems for missiles, radars, submarines, etc.
2. Medical aspects: cold force, cold healing, cataract extraction film, blood analyzer, etc.
3. Laboratory equipment: cold traps, cold boxes, cold baths, electronic low-temperature test devices, various constant temperature, high and low temperature experimental instruments.
4. Special equipment: low temperature tester for petroleum products, low temperature tester for biochemical products, bacterial incubator, constant temperature developing tank, computer, etc.
5. Daily life: air conditioning, hot and cold boxes, drinking fountains, etc.
